PoP Flux Dipping Process Inspection: Colored Flux
Indium Corporation's new colored fluxes for PoP flux inspection and assembly....
PoP Flux
Optimizing the PoP Flux Dipping Process
Often times people assume that the dipping process is easy… it is once you have taken the time up-front to optimize the process. The opti...
PoP Flux vs. PoP Paste
I have recieved a number of inquiries over the years regarding Pack-on-Package (PoP) Manufacturing Processes. One of the most frequent questions ...
IMAPS 2013: International Symposium on Microelectronics
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending b...
Variables in the Package-on-Package Process
When designing a Package-on-Package (PoP) assembly process, there are many variables that need to be considered in order to be successful. While...
Solder Paste and Flux Dip Depth: II
Following on from our discussions of last time... As you will recall from the previous post on this topic, My friend and colleague Chris Nash and I w...
Solder Paste and Flux Dip Depth: I
My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-pac...
Indium Corporation at Semicon West 2011
Many, many thanks to the hundreds of you who came by the Indium Corporation booth at Semicon West this year. Some of you came to hear about ...
Epoxy Flux Dipping for CSP and PoP Applications
This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package (PoP) device to be picked up from the dippi...