Since the Semi-Therm Symposium and Exhibit promotes itself as the “premier symposium for semiconductor thermal management which fosters network building and ties that would stay the test of time”, it is no surprise that this is their 34th year of highlighting “thermal innovations that keep the world’s technology cool”.
Indium Corporation is looking forward to being a part of this important forum that provides opportunities to review and discuss the latest thermal management technologies and products.
We will be showcasing our full line of metal thermal solutions that can improve the longevity and reliability of semiconductor and power devices:
- Heat-Spring®: a patterned material that improves contact between non-planar surfaces.
- HSMF and HSMF-OS: a layered non-silicone polymer and aluminum that provides an easy-to-use alternative to gels and greases.
- Indium-contained materials: an excellent solution for high end cooling challenges. Indium metal is one of the most thermally conductive metals and can also be recycled.
- Sn+ materials: a great alternative for applications requiring less heat dissipation, but that still need the ease of use of the metal solution.
Tim Jensen (Senior Product Manager-Thermal Materials) will be at the show along with Ron Hunadi (Market Development Manager for Semiconductor and Advance Materials) and Sehar Samiappan (Regional Manager, Northern California). They are looking forward to meeting with you to discuss your application. If you can’t make it to the show, check us out at www.indium.com/TIMS or contact us at askus@indium.com.
