Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electroni...
Solder Bumping
One-Step OSP BGA Soldering Application
The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex...
Effect of Package and Die Size on Dipping and Pick-up
While in South East Asia last summer, Indium’s technical team and I had a chance to discuss flip-chip dipping processes with a major equipment v...
Reflow of Copper Pillar Microbumps
Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...
Ball-Attach Flux WS-446-NRD for Poor Quality OSP-wetting
While on a recent trip to Malaysia, I interviewed two colleagues regarding trends in semiconductor assembly. My previously-published interview with Sz...
Solder Paste and Flux Dip Depth: I
My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-pac...
Package-on-Package (PoP) Solder Paste
A quick trip to discuss roadmapping with one of the world’s top processor manufacturers, and a visit to discuss Pb-free power die-attach materia...
Epoxy Flux Dipping for CSP and PoP Applications
This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package (PoP) device to be picked up from the dippi...
Wafer and Substrate Bumping with Solder Paste (II)
… and we’re back on the question of “how small a solder powder particle do I need, to achieve a certain bump height or bump diameter...
Wafer and Substrate Bumping with Solder Paste (I)
This week’s topic is both wafer bumping and substrate bumping with solder paste, and the issue of powder size. I’ve recently been dea...
Solder Paste: Drying Out or Relaxing?
Had some very interesting conversations at the IWLPC show last week, as always: one discussion was with my good friend Jeff Schake of Dek. He knew I h...
Solder Paste – Flux
The second main ingredient in solder paste is the flux (vehicle). Flux is a very complex group of chemicals/materials that must be able to do a number...