Driving the Packaging Frontier: Part 2
Indium Corporation’s Sze Pei Lim, talks about when to make th emove from water-soluble to no-clean fluxes for flip-chip assembly packages....
Videos
Driving the Packaging Frontier: Part 1
Indium Corporation’s Dr. Andy Mackie, Senior Product Manager, Semiconductor and Advanced Assembly Materials, and Sze Pei Lim, Regional Manager, ...
Adopting Semiconductor Assembly Process Techniques and Technologies
Indium Corporation’s Miloš Lazić, Technical Support Engineer, and Sze Pei Lim, Regional Manager, Semiconductor, discuss new technolo...
Part of a Whole
Indium Corporation's Technical Support Engineers are often involved with different projects and departments on a daily basis. All these get us clo...
Video: Global SMT & Packaging - Brian Craig, Managing Director - Indium Corporation European Operations at SMTconnect 2019
Brian Craig discusses the challenges presented by the increasing electrical and electronic systems required by the automotive industry....
Indium Corporation Manufacturing Facilities Earn IATF-16949:2016
I am proud to announce that five of Indium Corporation's manufacturing facilities have earned IATF-16949:2016 certificates....
SCOOPstudio Roundtable - Avoiding Voids, Clinic Outcomes – APEX 2019
MB Allen, Product Manager at KIC and Kim Flanagan, Technical Support Engineer at Indium Corporation joined SCOOP’s Philip Stoten to share the cl...
Indium Corporation Technical Papers at SMTAI
This video highlights some must-see activities at SMTAi 2018 in Rosemont, Illinois on October 14-18. LIVE@SMTAi allows you to see Indium Cor...
Tech Seconds: What is a Shoulder Reflow Profile?
In this installment of Tech Seconds, Phil describes when to use a shoulder profile. ...
Tech Seconds: How to Troubleshoot Head-in-Pillow (HIP) Defects
In this installment of Tech Seconds, Phil examines the best methods used to troubleshoot head-in-pillow (HIP) defects ...
Tech Seconds: X-ray Analysis Electronics Assembly
In this installment of Tech Seconds, Phil discusses the basics of X-ray analysis for electronics assembly and how to identify soldering voids....
Tech Seconds: How to Eliminate Head-in-Pillow (HIP) Defects
In this installment of Tech Seconds, Phil describes how to diagnose defects caused by head-in-pillow (HIP). ...