Webinar on Voiding June 11, 9AM and 2PM EST
Folks, I will be presenting a workshop on “Understanding and Troubleshooting Voiding in Bottom Terminated Components (BTCs)." BTCs are one ...
Voiding
Avoid The Void™ - Identifying Causes of Die-Attach Soldering Voids
“How do I reduce my die-attach voids?” There is no sliver bullet, but here is a process to help you identify and reduce your voiding....
Tips for Successfully Using Vacuum Reflow Ovens in SMT Soldering
Vacuum Reflow can help reduce voiding in SMT assembly but the process varies from conventional convection reflow. Here's how to achieve the&...
Avoid the Void®: An Introduction to Indium10.1HF Solder Paste
Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow introduce Indium Corporation’s new halogen-free, no-cl...
How Process Variables Affect Variation in QFN Voiding
Indium Corporation's been doing extensive testing on the effect of different process variables on voiding and QFNs... ...
Automotive: Solder Paste Particle Size Effect on Voiding in Bottom-Terminated Components
The results were very interesting as the ROL0 (halide-free) paste performed better than the ROL1 (halide-containing) solder paste. Generally, halides ...
Avoid the Void® Common Causes of Voiding in Electronics Assembly
This video is for anyone interested in the causes and effects of voiding in solder paste. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, voidin...
Flux-Cored Wire in Robotic Soldering
Looking for a way to Avoid the Void® using high-quality cored wire? Click here....
PCs, Tablets, and Mobile Phones are not Dying and will Continue to Present Voiding Challenges
The Professor leads an informative discussion on the future of portable electronics....
No-Clean Fluxes in Semiconductor Assembly
We explore cleaning techniques for Internet of Things (IoT) devices. It will cover water-soluble and no-clean materials and process....
Voiding in Die-Attach Electronics Assembly
This video is for people who are trying to select or develop the proper reflow profile for a die-attach process. It will tell you the differences betw...
Causes and Solutions to Voiding in Die-Attach
This video is for engineers challenged by voiding in die-attach electronics assembly applications. It covers causes and methods to Avoid the Void®...