In Process Solution Series Part 2: Industry Progression to Miniaturization, roundtable guests will discuss new manufacturing challenges caused by miniaturization, including those within the printer process, solder paste powder size, placement improvements, and inspection. The roundtable will be followed by a live Q&A

In Power Electronics: Improve Bondline Control & Reliability with a Reinforced Matrix Solder Solution, Hertline will examine how InFORMS®, a reinforced matrix solder composite preform and ribbon (patent pending), delivers uniform bondline control with superior mechanical strength, enhancing reliability by a factor of 2X while achieving the lowest cost of ownership.

Following the highly successful panel discussion in June, we are revisiting this topic to learn more about some of the latest techniques, materials and processes to meet the challenge of working with low-temp solders.

As power devices evolve to handle increased power density, higher junction temperatures, and smaller packaging, the enhanced requirements for high-reliability power electronics have posed many challenges to the packing and assembly processes. During The Challenges of High-Reliability Power Electronics Assembly and the Emerging Materials Solutions, Hertline will analyze the major challenges within substrate- and die-attach applications, as well as provide an overview of the innovative materials solutions that can help achieve high power density and promote better heat dissipation, resulting in highly-reliable power devices. 

Solder Preform World will examine the creative world of solder preforms, from the basics to their current use as incredibly engineered options with a wide range of possibilities. Some topics to be covered include soldering applications, solder alloys, preform types, inspection, and process defects. The webinar will include a question and answer session. Attendees with specific questions or failure examples are encouraged to provide them before the event.

The webinar is organized and hosted by Bob Willis, an England-based trainer and consultant with more than 30 years of experience working with companies implementing surface mount technology (SMT) and area array technology, as well as most areas of electronics manufacturing. 

The webinar is free to join, but attendees are encouraged to donate a small amount to two chosen charities, Mind – Better Mental Health and Marie Curie – Living with Terminal Illness

The specifications for the product lifetime validation of electronic assemblies are increasing due to the changing requirements as they relate to duration of use as well as service and ambient temperatures. This makes solder materials more critical, as the solder paste attributes have a direct correlation to these increased product service life reliability requirements. During his webinar, Highly Reliable Assemblies for Highly Effective Manufacturing Processes, Karch will discuss the parameters that should be taken into consideration and how to calculate the service life using the Coffin-Manson model. He’ll also share information about test standards and relevant solder materials that need to be optimized for a high-mix/low-volume scenario, thus placing heavier demands on the solder paste flux chemistry