Today we will be discussing the first feature article appearing in the last issue of Advanced Packaging Magazine, “Weathering the Storm – Industry Forecast 2009”. This seems an ironic title to be in the last publication of Advanced Packaging…
A cross-section of industry experts (including our own Andy Mackie) give their view of what the future may bring for semiconductor packaging. Most of the interviews project which technological advancements will be popular in 2009, while some discuss optimistic points during an otherwise harsh time.