Overview of InFORMS®
In the world of electronics manufacturing, especially in high-stress applications like power modules and electric vehicle inverters, ensuring the reliability and durability of solder joints is crucial. This is where InFORMS® comes into play, offering a revolutionary solution to the challenges posed by other solder materials.
What are InFORMS®
InFORMS® are solder preforms that incorporate a reinforced matrix, resulting in a significant enhancement in the strength and reliability of the solder joints and addressing common issues such as uneven bondline thickness and stress concentration, which can lead to delamination and failure over time.
Why InFORMS®?
One of the standout features of InFORMS®, as mentioned above, is their ability to provide consistent bondline thickness. This uniformity is crucial in maintaining both the thermal and mechanical reliability of solder joints, making them ideal for applications that experience high thermal and mechanical demands.
Other Key Advantages:
- Enhanced Strength: The reinforced matrix within the solder significantly boosts both tensile and compressive strength, ensuring that the solder joints can withstand the increasing operational use cases in power electronics including temperature and power density.
- Improved Stress Distribution: Unlike other solutions, the fully-integrated InFORMS® matrix is distributed throughout the solder interface. This allows for even distribution of mechanical loads, preventing stress concentrations inherent with single bondline control technologies and extending reliability performance.
- Customization: InFORMS® can be manufactured in a variety of shapes and sizes, including ribbons for automated assembly. InFORMS® are also available for a wide range of Pb-free and Pb solder alloys, making them versatile enough to meet the specific needs of different applications.
- Drop-In Solution: The InFORMS® solder preform technology can be used as a direct replacement for standard solder preforms–without the need for process modifications in the assembly or reflow operations. This provides a straightforward path to increasing device life without significant design changes.
Applications of InFORMS®
InFORMS® are particularly beneficial in scenarios where there is a relatively large soldering area, as both the effects of planarity and thermomechanical stress increase as a function of size. One prime example is in the production of IGBT and SiC power modules, where InFORMS® can be used to bond the substrate to the baseplate or cooler. The added strengthening and repeatable bondline provided by InFORMS® ensure that these modules can operate consistently over an extended lifecycle under high thermal and mechanical stress.
Summary
InFORMS® by Indium Corporation are a game-changer for industries requiring high-reliability solder joints in demanding environments. Their reinforced matrix structure not only improves the mechanical properties of the solder, but also ensures consistent standoff heights, which is critical for the longevity and performance of electronic components.
Stay tuned for future posts on InFORMS® including design best practices and application suggestions.