Folks,
SMTAI is always a great conference. It is in my second favorite place, Rosemont, IL. (It’s tough to beat Disney World.) Not only are there scores of great papers, but there are also professional development courses.
I will be presenting a paper on "Soldering Challenges Caused by Warpage and Deformation of Large-Size Server Integrated Circuits", with co-authors Wisdom Qu and Chris Nash. This paper highlights Durafuse®LT and shows how it will minimize BGA warping failure modes like the head-in-pillow (HiP) defect.
See also these other papers by my Indium Corporation colleagues:
- "Effects of Dynamic Warpage on the Solder Joints of Large Plastic Ball-Grid Arrays Assembled with LTS" by Francis Mutuku, Hongwen Zhang, Huaguang Wang, and Tyler Richmond, Indium Corporation.
- "Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components" by Ravi Parthasarathy, M.S.Ch.E., ZESTRON Corporation; Patrick Lawrence, ITW EAE; Evan Griffith, Indium Corporation.
- "Fluxless Reflow Technology for Combination Fine-Pitch and SMT-Level Component Attach" by Evan Griffith, Indium Corporation; David Heller, Xike Zhao, and Phil Lehrer, Heller Industries.
- "Supercooled Solder Pastes in Low Temperature Attach Applications" by Yifan Wu, Ph.D., Ian Tevis, Radhika Jadhav, Indium Corporation.
I hope to see you there!
Cheers,
Dr. Ron