12.8HF for Jetting and Microdispensing:
As the electronics industry continues to focus on smaller, more complex, and more powerful devices, components are being packed into very tight footprints. This can make solder paste deposition a challenge; however, Indium 12.8HF solder paste is specially formulated for long-term jetting and microdispensing and engineered to fit into a variety of systems. Compatible with fine powders and featuring a flexible metal load to provide better overall dispensability, as well as line dispensing and enhanced microdispensing, its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues. Learn more at indium.com/jetting-paste.